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POC-400 Series / Intel® Elkhart Lake Atom® x6425E Ultra-compact Fanless Embedded Computer with 2.5GbE & PoE+
POC-400 is an ultra-compact fanless embedded computer for industrial applications.
- Intel® Elkhart Lake Atom® x6425E quad-core 2.0GHz/ 3.0GHz 12W processor
- Rugged -25 °C to 70 °C fanless operation
- 2x 2.5GbE PoE+ ports and 1x 2.5GbE port with screw-lock
- 2x USB 3.1 Gen1 and 2x USB 2.0 ports with screw-lock
- M.2 2280 M key SATA interface
- Dual DP display outputs supporting 4096 x 2160 resolution
- Front I/O access DIN-mounting design
- MezIO™ compatible
Aplicación: Industrial / Comunicación / Vision
Tipo: Rugged embedded
POC-400 is an ultra-compact fanless embedded computer for industrial applications.
It utilizes the latest Intel® Elkhart Lake platform Atom® x6425E 4-core CPU that can deliver 1.8x CPU and 2x GPU performance improvement, compared to the previous generation. In addition to the performance boost, POC-400 features an ultra-compact design measuring just 56 x 108 x 153 mm, which can easily fit into restricted spaces. The system comes with a DIN-rail mounting chassis and an abundance of front-access I/O interfaces. Featuring three 2.5GBASE-T Ethernet ports with IEEE 802.3 PoE+ capability, they provide higher data bandwidth for devices such as NBASE-T cameras and is backward-compatible with 1000/100/10 Mbps Ethernet. It also has two 4K DisplayPort, 2x USB3.1 Gen1, 2x USB 2.0 and COM ports for general industrial applications.
Supporting Neousys' proprietary MezIO™ interface for function expansion, you can add functions such as isolated DIO, RS-232/422/485, ignition control and 4G/ 5G by installing a MezIO™ module. Moreover, POC-400 comes with an internal M.2 E key socket for a Google TPU or an Intel® Movidius VPU module to transform it into a lightweight AI inference platform at the edge.
Combining the new 10nm Atom® CPU, 2.5G Ethernet ports, PoE+ and ultra-compact enclosure with function expansion capabilities, Neousys’ POC-400 is a compact and yet versatile embedded controller that can fuel various industrial applications.
POC-400 Series |
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System core |
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| Processor | Intel® Elkhart Lake Atom® x6425E quad-core 2.0GHz/3.0GHz 12W processor |
| Graphics | Integrated Intel® UHD Graphics |
| Memory | Up to 32 GB DDR4-3200 SDRAM by one SODIMM socket |
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I/O interface |
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| Ethernet |
3x 2.5GBASE-T Ethernet ports by Intel® I225 GbE controllers |
| PoE | Optional IEEE 802.3at PoE+ on port #2 and #3 |
| USB | 2x USB 3.1 Gen1 (5 Gbps) ports 2x USB 2.0 ports |
| Serial Port |
1x software-programmable RS-232/422/485 ports (COM1) 3x 3-wire RS-232 ports (COM2/3/4) or 1x RS-422/485 port (COM2) |
| Video Port | 2x DisplayPort connector, supporting 4096 x 2160 resolution @ 60Hz |
| Audio | Optional 1x 3.5 mm jack for mic-in and speaker-out |
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Storage Interface |
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| M.2 M key | 1x M.2 2280 SATA interface |
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Internal Expansion Bus |
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| M.2 E key | 1x M.2 2230 E key socket for WiFi, Google TPU or Movidius VPU module |
| Expandable I/O |
1x MezIO™ expansion port for Neousys MezIO™ modules |
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Power Supply |
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| DC Input | 1x 3-pin pluggable terminal block for 8-35V DC input |
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Mechanical |
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| Dimension | 56 mm (W) x 108 mm (D) x 153 mm (H) |
| Weight | 0.96kg |
| Mounting | DIN-rail mount (standard) or Wall-mount (optional) |
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Environmental |
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| Operating temperature | -25°C ~ 70°C*/** |
| Storage temperature | -40°C ~85°C |
| Humidity | 10%~90%, non-condensing |
| Vibration | Operating, MIL-STD-810G, Method 514.7, Category 4 |
| Shock | Operating, MIL-STD-810G, Method 516.7, Procedure I |
| EMC | CE/FCC Class A, according to EN 55032 & EN 55035 |
* The 100% CPU/GPU loading for high temperature test is applied using Passmark® BurnInTest™ v8.0. For detail testing criteria, please contact Neousys Technology
** For sub-zero operating temperature, a wide temperature HDD drive or Solid State Disk (SSD) is required.
POC-400
Intel® Elkhart Lake Atom® x6425E ultra-compact DIN-rail fanless rugged computer with 1x 2.5GbE, 2x 2.5G PoE+ and 2x USB 3.1 Gen1
POC-410
Intel® Elkhart Lake Atom® x6425E ultra-compact DIN-rail fanless rugged computer with 3x 2.5GbE and 2x USB 3.1 Gen1
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