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QBiX-JMB-CMLA47EHGP-A1 / Industrial system with Intel® Q470E Chipset, support for Intel® 10th Gen Processors, discrete GFX card

QBiX-JMB-CMLA47EHGP-A1 / Industrial system with Intel® Q470E Chipset, support for Intel® 10th Gen Processors, discrete GFX card

Industrial system with Intel® Q470E Chipset, support for Intel® 10th Gen Processors, discrete GFX card and 850W power supply.

- System size : 224W x 368D x 166.3H(mm) -- Discrete GFX card support (optional)
- Support Intel® 10th Gen Processor
- Dual Channel DDR4, 2 x SO-DIMMs
- DVI-D, VGA & DP ports for multiple display
- 4 x GbE LAN Ports
- 4 x COM Ports
- 10 x USB Ports

Aplicaciones:
Transporte, visión artificial, industrial.

 2,5" drive   

0,00 €
Impuestos incluidos

QBiX-JMB-CMLA47EH-A1

CARACTERÍSTICAS


Dimensiones
 224W x 368D x 166.3H(mm)
CPU
 Support for 10th Generation
Intel® Core™ i9/i7/i5/i3, Pentium® and Celeron® processors in the LGA1200 package
TDP under 65W
Chipset
 Intel® Q470E Express Chipset
Memory
 2 x DDR4 SO-DIMM sockets, Max. Capacity 64 GB
Support Dual Channel DDR4 3200 MHz memory modules
Ethernet
 1 x GbE LAN Port (Intel® I219V)
3 x GbE LAN Ports (Intel® I211AT)
Graphic Support
 Integrated Graphics Processor - Intel® HD Graphics support:
1 x DP port, supporting a maximum resolution of 4096x2160 @60Hz
1 x DVI-D port, supporting a maximum resolution of 1920x1080 @60Hz
1 x VGA port, supporting a maximum resolution of 1920x1200 @60Hz
(3 independent display outputs)
Audio
 Realtek® Audio Codec
Storage
 4 x 2.5″ HDD/SSD (SATA 6Gb/s)
Expansion Slots
 1 x 2280 M.2 M-Key (PCIe x4 & SATA 6Gb/s)
1 x 2230 M.2 E-Key (WiFi/BT)
1 x Full-size mini PCIe with SIM slot
1 x PCIe slot -- Discrete riser card support
Front I/O
 1 x Power Switch/Power/HDD LED
3 x Audio Jacks (Line in, Line out, Mic in)
1 x Display Port
1 x DVI-D
1 x VGA
2 x COM Ports (RS-232/422/485 & RI/5V/12V)
2 x COM Ports (RS-232)
4 x RJ45 LAN Ports
4 x USB 3.2 Gen1
6 x USB 2.0
2 x External Antenna Holes (Optional)
Riser card (Optional)
 1 x PCIe x4 (Gen3 x4)
2 x PCIe x16
— Single at Gen3 x16 only
or
— Dual at Gen3 x8 + Gen3 x8
Power
 850W Power Supply Built-in
Operation Temperature

For Main system :
Operating temperature: -20°C to 50°C (CPU TDP 65W)
Operating temperature: -20°C to 60°C (CPU TDP 35W)

For Full system :
Depends on the Graphic cards installed in the system

Operating humidity: 0-90% (non-condensing)
Non-operating temperature: -20°C to 80°C
Non-operating humidity: 0%-90% (non-condensing)
Use wide temperature range memory and storage
Vibration During Operation
 Operation: IEC 60068-2-64, 1 Grms, random, 5 ~ 500 Hz, 1 hr / Per Axis, with SSD/M.2 2280 & Without Graphics Cards
Non-operation: IEC 60068-2-6, 2 G, Sine, 10 ~ 500 Hz, 1 Oct/min, 1 hr / Per Axis
Shock During Operation
 Operation: IEC 60068-2-27, 50 G, half sine, 11 ms duration, With SSD

Para más información sobre este producto llámenos al 917 21 60 10 o solicite presupuesto aquí. Le responderemos antes de 24 horas. CENVALSA, compromiso de calidad.

Fabricante: