POC-700-FT Series / Intel® Alder Lake Ultra-Compact Embedded Computer with MezIO® Interface and flattop heatsink
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POC-700-FT Series / Intel® Alder Lake Ultra-Compact Embedded Computer with MezIO® Interface and flattop heatsink

Intel® Alder Lake Ultra-Compact Embedded Computer with 4x PoE+, 4 USB 3.2, MezIO® Interface and flattop heatsink. PC industrial

- Intel® Alder Lake Core™ i3-N305 processor 15W with 8 E-Cores or Atom® x7425E
- Up to 16GB DDR5-4800 SODIMM
- Flattop heatsink design
- -25 °C to 60 °C rugged wide temperature fanless operation
- 4x GbE ports PoE+ / 4x USB3.2 Gen 2 with screw-lock
- 4-CH isolated DI + 4-CH isolated DO
- DP++ / HDMI 1.4b dual display outputs
- MezIO® compatible

0,00 €
Impuestos incluidos

The POC-700-FT is a variant of Neousys' acclaimed POC-700 series, featuring a unique flattop heatsink design that allows it to be applied to other categories of applications. The large thermal conduction area of the flattop heatsink helps effectively transfer heat to the outer surface and makes POC-700-FT particularly applicable for installation inside a sealed enclosure, where airflow is limited.

The POC-700-FT series is equipped with a Intel® Core™ i3-N305 8-core/ 8-thread processor, along with 32EUs UHD Graphics, or an Atom® x7425E 4-core/ 4-thread processor, with 24EUs UHD Graphics. Both options are optimized for AI inference tasks via Intel OpenVINOTM.

The system supports DDR5-4800 memory and includes an M.2 2280 M key NVMe slot for fast disk access. It also has four USB 3.2 Gen2 ports and four GigE PoE+ ports with screw-lock mechanisms, ensuring reliable connections for Ethernet/ USB cameras. POC-700-FT also offers COM ports and isolated DIO for monitoring and controlling devices, as well as a mini-PCIe slot that accommodates wireless modules such as WiFi, LTE/5G, or CAN bus devices.

POC-700-FT fits for deployed in challenging environments, such as oil/ gas, mining, those requiring dust and water resistance.

POC-700-FT Series


CARACTERÍSTICAS

POC-715-FT

POC-712-FT

System core

Processor Intel® Alder Lake Core™ i3-N305 processor (8C/8T, 1.8/3.8 GHz,15W TDP) Intel® Alder Lake Atom® x7425E processor (4C/4T, 1.5 /3.4 GHz, 12W TDP)
Graphics Integrated Intel® UHD Graphics with 32EUs Integrated Intel® UHD Graphics with 24EUs
Memory Up to 16 GB DDR5-4800 SDRAM (one SODIMM socket)
TPM Supports dTPM 2.0

Panel I/O interface

Ethernet
4x Gb Ethernet ports by Intel® I350-AM4
PoE+ IEEE 802.3at PoE+ on port #1~ 4 -
Native Video Port 1x DP++, Supporting 4096 x 2160 resolution
1x HDMI1.4b, Supporting 3840 x 2160 30Hz
Serial Port
1x Software-programmable RS-232/422/485 ports (COM1)
3x 3-wire RS-232 ports (COM2/3/4) or 1x RS-422/485 port (COM2)
Isolated DIO 4-CH isolated DI and 4-CH isolated DO
USB 4x USB 3.2 Gen2 ports with screw-lock

Storage Interface

M.2
1x M.2 2280 M key socket (PCIe Gen3 x1) for NVMe SSD storage (supports SATA signal)

Expansion Bus

Expandable I/O 1x MezIO® expansion interface for Neousys MezIO® modules
Mini-PCIe
1x full-size mini PCI Express socket with internal micro SIM socket

Power Supply

DC Input 1x 3-pin pluggable terminal block for 8 to 35V DC input
Remote Ctrl.& LED Output 1x 3-pin pluggable terminal block for remote control and PWR LED output

Mechanical

Dimension 175.8mm (W) x 115.5mm (D) x 51.65mm (H)
Weight 1.2kg
Mounting Wall-mount (Standard)

Environmental

Operating temperature -25°C ~ 60°C [1][2]
Storage temperature -40°C ~85°C
Humidity 10%~90%, non-condensing
Vibration MIL-STD-810H, Method 514.8, Category 4
Shock MIL-STD-810H, Method 516.8, Procedure I
EMC CE/ FCC Class A, according to EN 55032 & EN 55035

[1] For sub-zero operating temperature, a wide temperature storage is required.
[2] The system was tested while mounted on an aluminum panel measuring 60(W) x 60(D) x 0.3(H) cm in a high temperature environment to simulate in-cabinet conditions. For more information, please refer to the user manual.

POC-715-FT
Intel® Core™ i3-N305 Ultra-Compact Fanless Embedded Computer with 4x PoE+, 4x USB 3.2, MezIO® Interface and flattop heatsink

POC-712-FT
Intel® Atom® x7425E Ultra-Compact Fanless Embedded Computer with 4x GbE, 4x USB3.2, MezIO® Interface and flattop heatsink

Supported MezIO® Modules
Neousys MezIO® module offers computer signals, power rails and control signals via a high-speed connector. It transforms Neousys embedded systems into application-specific systems with application-oriented I/Os such as RS-232/422/485, isolated DIO and ignition power control.

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